The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Dec. 21, 2021
Infineon Technologies Ag, Neubiberg, DE;
Andreas Grassmann, Regensburg, DE;
Wolfram Hable, Neumarkt, DE;
Juergen Hoegerl, Regensburg, DE;
Ivan Nikitin, Regensburg, DE;
Achim Strass, Munich, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A package includes: at least one electronic chip; an encapsulant encapsulating at least part of the at least one electronic chip; a shielding layer on at least part of an external surface of the encapsulant; and a first heat removal body thermally coupled to the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip to a cooling fluid. The encapsulant has a surface portion that extends in a surface region extending laterally directly adjacent to the first heat removal body. The surface portion of the encapsulant delimits part of a cooling cavity configured to guide the cooling fluid. The shielding layer covers the surface portion of the encapsulant. A corresponding electronic device, method of manufacturing the package, method of manufacturing the electronic device, vehicle, and method of using the electronic device are also described.