Company Filing History:
Years Active: 2019-2024
Title: Achim Strass: Innovator in Electronic Packaging Technology
Introduction
Achim Strass is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electronic packaging technology, holding a total of 4 patents. His work focuses on innovative solutions that enhance the performance and efficiency of electronic devices.
Latest Patents
One of Achim Strass's latest patents is titled "Fluid-cooled package having shielding layer." This invention includes a package that comprises at least one electronic chip, an encapsulant that encapsulates part of the chip, and a shielding layer on the encapsulant's external surface. The design is aimed at efficiently removing thermal energy from the electronic chip to a cooling fluid. The encapsulant features a surface portion that extends laterally adjacent to a first heat removal body, which is thermally coupled to the chip. This innovative design not only guides the cooling fluid but also ensures that the shielding layer effectively covers the encapsulant's surface portion.
Another patent, "Package cooled with cooling fluid and comprising shielding layer," further emphasizes the importance of thermal management in electronic devices. This package also includes an electronic chip and encapsulant, with a shielding layer designed to protect the interior from cooling fluid while efficiently removing thermal energy.
Career Highlights
Achim Strass is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to develop cutting-edge technologies that address the challenges of modern electronic devices.
Collaborations
Throughout his career, Achim has collaborated with esteemed colleagues such as Andreas Grassmann and Wolfram Hable. These partnerships have fostered innovation and contributed to the advancement of electronic packaging technologies.
Conclusion
Achim Strass is a prominent figure in the field of electronic packaging, with a focus on thermal management solutions. His patents reflect his commitment to innovation and excellence in technology.