The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2019
Filed:
Aug. 01, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Andreas Grassmann, Regensburg, DE;
Wolfram Hable, Neumarkt, DE;
Juergen Hoegerl, Regensburg, DE;
Ivan Nikitin, Regensburg, DE;
Achim Strass, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); B60R 16/02 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 23/46 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); B60R 16/02 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/4334 (2013.01); H01L 23/46 (2013.01); H01L 21/4871 (2013.01); H01L 23/3157 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 2224/05014 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01);
Abstract
A power module which comprises a semiconductor chip, at least one cooling plate with at least one cooling channel thermally coupled to the semiconductor chip and being configured so that a coolant is guidable through the at least one cooling channel, and an encapsulant encapsulating at least part of the semiconductor chip and part of the at least one cooling channel, wherein at least part of a main surface of the cooling plate forms part of an external surface of the power module.