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For the Inventor, By the Inventor

Wuppertal, Germany

Andreas Grassmann

USPTO Granted Patents = 31 

 

Average Co-Inventor Count = 2.7

ph-index = 5

Forward Citations = 58(Granted Patents)


Location History:

  • Bad Abbach, DE (2003)
  • Regensburg, DE (2016 - 2024)

Company Filing History:

goldMedal29 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal2 out of 2,093 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal1 out of 18,523 
 
Hyundai Motor Company
 patents
4. 1 out of 50 
 
Kia Motor Corporation
 patents
where one patent can have more than one assignee

Years Active: 2003-2025

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31 patents (USPTO):
1. 12261063 - Method and device for producing a housing (2025-03-25),
2. 12211824 - Power semiconductor package having first and second lead frames (2025-01-28),
3. 12165959 - Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method (2024-12-10),
4. 11973012 - Power module with semiconductor packages mounted on metal frame (2024-04-30),
5. 11908760 - Package with encapsulated electronic component between laminate and thermally conductive carrier (2024-02-20),
6. 11862533 - Fluid-cooled package having shielding layer (2024-01-02),
7. 11626351 - Semiconductor package with barrier to contain thermal interface material (2023-04-11),
8. 11598904 - Power semiconductor module and method for producing a power semiconductor module (2023-03-07),
9. 11574889 - Power module comprising two substrates and method of manufacturing the same (2023-02-07),
10. 11264356 - Batch manufacture of packages by sheet separated into carriers after mounting of electronic components (2022-03-01),
11. 11244886 - Package cooled with cooling fluid and comprising shielding layer (2022-02-08),
12. 11171066 - Semiconductor panels, semiconductor packages, and methods for manufacturing thereof (2021-11-09),
13. 11056458 - Package comprising chip contact element of two different electrically conductive materials (2021-07-06),
14. 10615097 - Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet (2020-04-07),
15. 10586756 - Chip carrier configured for delamination-free encapsulation and stable sintering (2020-03-10),

Title: The Innovative Mind of Andreas Grassmann

Introduction: Andreas Grassmann, a visionary inventor hailing from Wuppertal, Germany, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Andreas Grassmann holds several patents in the areas of renewable energy, sustainable transportation, and advanced manufacturing processes, showcasing his commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Andreas Grassmann has worked with leading research institutions and technology companies to develop cutting-edge solutions that have revolutionized various industries. His innovative spirit and dedication to excellence have earned him recognition as a pioneer in his field.

Collaborations: Throughout his career, Andreas Grassmann has collaborated with top engineers, scientists, and designers to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of numerous projects that have had a lasting impact on society.

Conclusion: Andreas Grassmann's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and entrepreneurs. His contributions to the world of technology serve as a testament to the power of creativity and perseverance in driving positive change.

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