The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Jan. 13, 2022
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Andreas Grassmann, Regensburg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/14 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/31 (2013.01); H01L 21/56 (2013.01); H01L 23/14 (2013.01); H01L 23/29 (2013.01);
Abstract
A package is disclosed. In one example, the package comprises a carrier comprising a thermally conductive and electrically insulating layer, a laminate comprising a plurality of connected laminate layers, an electronic component mounted between the carrier and the laminate. An encapsulant is at least partially arranged between the carrier and the laminate and encapsulating at least part of the electronic component.
Grassmann, Andreas. (2024). Package with encapsulated electronic component between laminate and thermally conductive carrier (U.S. Patent No. 11908760). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11908760
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile