The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Nov. 21, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Thorsten Meyer, Regensburg, DE;

Andreas Grassmann, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/055 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 23/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/055 (2013.01); H01L 21/486 (2013.01); H01L 21/52 (2013.01); H01L 23/08 (2013.01);
Abstract

A method for manufacturing a semiconductor panel is disclosed. In one example, the method includes providing a first preformed polymer form. The method further includes arranging multiple semiconductor chips over the first preformed polymer form. The method further includes attaching a second preformed polymer form to the first preformed polymer form, wherein the semiconductor chips are arranged between the attached preformed polymer forms, and wherein the attached preformed polymer forms form the semiconductor panel encapsulating the semiconductor chips.


Find Patent Forward Citations

Meyer, Thorsten. (2021). Semiconductor panels, semiconductor packages, and methods for manufacturing thereof (U.S. Patent No. 11171066). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11171066

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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