The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2023
Filed:
Jan. 26, 2021
Infineon Technologies Ag, Neubiberg, DE;
Ivan Nikitin, Regensburg, DE;
Timo Bohnenberger, Neutraubling, DE;
Andreas Grassmann, Regensburg, DE;
Martin Mayer, Nittendorf, DE;
Alexander Roth, Zeitlarn, DE;
Franz Zollner, Sinzing, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes a semiconductor die, an encapsulant body of electrically insulating material that encapsulates the semiconductor die, a thermal conduction plate comprising an outer surface that is exposed from the encapsulant body, a region of thermal interface material interposed between the thermal conduction plate and the semiconductor die, the region of thermal interface material being a liquid or semi-liquid, and a barrier that is configured to prevent the thermal interface material of the region from flowing laterally across the barrier.