Company Filing History:
Years Active: 2023
Title: The Innovative Mind of Timo Bohnenberger: Pioneering Semiconductors
Introduction: Timo Bohnenberger, an accomplished inventor based in Neutraubling, Germany, has made significant contributions to the field of semiconductor technology. With a focus on improving the efficiency of semiconductor packages, Timo holds a patent that addresses critical challenges in thermal management, which is paramount in electronic devices today.
Latest Patents: Timo Bohnenberger's most notable patent is for a "Semiconductor package with barrier to contain thermal interface material." This innovative design includes a semiconductor die encapsulated within a body of electrically insulating material. Central to this invention is a thermal conduction plate that has an outer surface exposed from the encapsulant. The patent features a region of thermal interface material, which can be a liquid or semi-liquid, strategically placed between the thermal conduction plate and the semiconductor die. Most uniquely, this design incorporates a barrier that effectively prevents the thermal interface material from flowing laterally across it, enhancing thermal performance and reliability in semiconductor packages.
Career Highlights: Timo Bohnenberger is currently employed at Infineon Technologies AG, a leading global semiconductor manufacturer recognized for its innovations in power and semiconductor solutions. Throughout his career, Timo has dedicated himself to advancing semiconductor technology, resulting in his valuable patent and contributions to various projects.
Collaborations: Timo has had the opportunity to work alongside esteemed colleagues like Ivan Nikitin and Andreas Grassmann. Their collaborative efforts foster an environment of innovation, leading to the development of cutting-edge technologies in the semiconductor domain.
Conclusion: Timo Bohnenberger's work exemplifies the spirit of innovation in the semiconductor industry. Through his patent focused on thermal interface materials, he addresses significant technical challenges that can lead to enhanced performance and efficiency in electronic devices. His contributions, aided by collaboration with fellow inventors at Infineon Technologies AG, continue to influence the future of semiconductor technologies.