Infineon Technologies Ag

Timo Bohnenberger

Ivan Nikitin

Andreas Grassmann

Alexander Roth

Martin Mayer

Franz Zollner

A semiconductor package includes a semiconductor die, an encapsulant body of electrically insulating material that encapsulates the semiconductor die, a thermal conduction plate comprising an outer surface that is exposed from the encapsulant body, a region of thermal interface material interposed between the thermal conduction plate and the semiconductor die, the region of thermal interface material being a liquid or semi-liquid, and a barrier that is configured to prevent the thermal interface material of the region from flowing laterally across the barrier.

Growing community of inventors

Neutraubling, Germany

Timo Bohnenberger