The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Oct. 12, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Andreas Grassmann, Regensburg, DE;
Wolfram Hable, Neumarkt, DE;
Juergen Hoegerl, Regensburg, DE;
Angela Kessler, Sinzing, DE;
Ivan Nikitin, Regensburg, DE;
Achim Strass, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 23/433 (2006.01); H01L 23/492 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/4924 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/66 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/45014 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/181 (2013.01);
Abstract
A chip carrier which comprises a thermally conductive and electrically insulating sheet, a first electrically conductive structure on a first main surface of the sheet, and a second electrically conductive structure on a second main surface of the sheet, wherein the first electrically conductive structure and the second electrically conductive structure extend beyond a lateral edge of the sheet.