Angela Kessler

This inventor holds 50 USPTO granted patents and 19 published patent applications, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2008-2026.

USPTO Granted Patents = 50 (Patent Applications = 19)

% Patents Active = 66.0

Average Co-Inventor Count = 4.2

ph-index = 7

Forward Citations = 146(Granted Patents)

Location History:

Regensburg, DE (2008 - 2017)
Sinzing, DE (2010 - 2024)

Company Filing History:

43 out of 15,005

Infineon Technologies Ag

patents

7 out of 2,194

Infineon Technologies Austria Ag

patents

Years Active: 2008-2026

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Areas of Expertise:

Semiconductor Device

Thermal Coupling

Passive Element

Voltage Regulator

Chip Carrier

Interposer

Molded Package

Power Semiconductor

Integration

Encapsulated Chip

Conductive Layers

Circuit Board

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12738406 - Inductor connectivity and assemblies (2026-09-15),

2. 12727489 - Semiconductor devices including a premolded leadframe and a semiconductor package (2026-09-01),

3. 12532737 - Semiconductor device package thermally coupled to passive element (2026-01-20),

4. 12431367 - Embedded package with shielding pad (2025-09-30),

5. 12237246 - Semiconductor devices including parallel electrically conductive layers (2025-02-25),

6. 12150236 - Voltage regulator module with inductor-cooled power stage (2024-11-19),

7. 12131988 - Semiconductor package and passive element with interposer (2024-10-29),

8. 12087740 - Method of forming a semiconductor module (2024-09-10),

9. 12033909 - Die package and method of manufacturing a die package (2024-07-09),

10. 12027436 - Package with clip having through hole accommodating component-related structure (2024-07-02),

11. 12009290 - Semiconductor module having a multi-branch switch node connector (2024-06-11),

12. 11848262 - Semiconductor package and passive element with interposer (2023-12-19),

13. 11817430 - Semiconductor module (2023-11-14),

14. 11664304 - Semiconductor module (2023-05-30),

15. 11056458 - Package comprising chip contact element of two different electrically conductive materials (2021-07-06),

Title: Angela Kessler - Innovative Inventor from Wuppertal

Introduction: Angela Kessler is a pioneering inventor based in Wuppertal, Germany, known for her groundbreaking contributions to various fields of technology and science.

Latest Patents: Angela Kessler holds several patents in the areas of renewable energy, sustainable materials, and medical devices, showcasing her diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Angela Kessler has worked with leading research institutions and universities to develop cutting-edge solutions that have had a significant impact on society. Her commitment to pushing the boundaries of innovation is evident in the numerous awards and accolades she has received throughout her career.

Collaborations: Angela Kessler has collaborated with top companies, research institutions, and fellow inventors from around the world to bring her ideas to life. These collaborations have not only enriched her work but have also paved the way for new and exciting innovations in the industry.

Conclusion: Angela Kessler's passion for innovation and her relentless pursuit of excellence have established her as a prominent figure in the world of inventors. Her dedication to creating a better future through technology continues to inspire generations of inventors and researchers worldwide.