The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Dec. 15, 2022
Infineon Technologies Ag, Neubiberg, DE;
Thorsten Scharf, Lappersdorf, DE;
Josef Höglauer, Kirchheim-Heimstetten, DE;
Angela Kessler, Sinzing, DE;
Claus Waechter, Sinzing, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor device includes a premolded leadframe, including a main surface, at least one electrical contact extending out of the main surface, and an opposite main surface arranged opposite to the main surface. The semiconductor device further includes a semiconductor package arranged on the main surface and laterally displaced to the at least one electrical contact of the premolded leadframe. The semiconductor package includes a semiconductor chip and at least one electrical contact. Surfaces of the at least one electrical contact of the premolded leadframe and the at least one electrical contact of the semiconductor package facing away from the main surface are flush.