The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
Feb. 16, 2021
Infineon Technologies Ag, Neubiberg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor assembly includes an interposer that includes an insulating substrate, a plurality of upper contact pads on an upper surface of the substrate, and a plurality of lower contact pads on a lower surface of the substrate, a semiconductor package that includes a semiconductor die embedded within a package body and a plurality of package terminals exposed from the package body, a first passive electrical element that includes first and second terminals, a first electrical connection between the first terminal of the first passive electrical element and a first one of the lower contact pads via the interposer, a second electrical connection between the second terminal of the first passive electrical element and a first one of the package terminals, and a third electrical connection between a second one of the package terminals and a second one of the lower contact pads via the interposer.