The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Mar. 16, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Christian Neugirg, Regensburg, DE;

Andreas Grassmann, Regensburg, DE;

Wolfram Hable, Neumarkt, DE;

Ottmar Geitner, Pentling, DE;

Frank Winter, Regensburg, DE;

Alexander Schwarz, Soest, DE;

Inpil Yoo, Unterhaching, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/40 (2013.01); H01L 23/373 (2013.01); H01L 24/36 (2013.01); H01L 2224/40137 (2013.01); H01L 2924/181 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49144 (2015.01);
Abstract

An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.


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