The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2019
Filed:
Aug. 24, 2018
Infineon Technologies Ag, Neubiberg, DE;
Mark Pavier, Felbrigde, GB;
Wolfram Hable, Neumarkt, DE;
Angela Kessler, Sinzing, DE;
Michael Sielaff, Erwitte, DE;
Anton Pugatschow, Soest, DE;
Charles Rimbert-Riviere, Soest, DE;
Marco Sobkowiak, Warstein, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of manufacturing a package, wherein the method comprises a forming a chip carrier by covering a thermally conductive and electrically insulating core on both opposing main surfaces thereof at least partially by a respective electrically conductive layer by brazing the respective electrically conductive layer on a respective one of the main surfaces; a mounting at least one electronic chip on the chip carrier; an electrically coupling an electrically conductive contact structure with the at least one electronic chip; and an encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip by a mold-type encapsulant.