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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9585241 B1

PDFFull Text
Date of Patent:
Feb. 28, 2017

Filed:

Sep. 24, 2013

Substrate, chip arrangement, and method for manufacturing the same

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Wolfram Hable, Neumarkt, DE;

Andreas Grassmann, Regensburg, DE;

Frank Winter, Regensburg, DE;

Ottmar Geitner, Pentling, DE;

Alexander Schwarz, Moehnesee, DE;

Alexander Herbrandt, Warstein, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:

Viering, Jentschura & Partner mbB

Primary Examiner:

Hoa C Nguyen

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 3/32 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H05K 1/03 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/021 (2013.01); H01L 21/4882 (2013.01); H01L 23/31 (2013.01); H01L 23/3735 (2013.01); H05K 3/32 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 23/49833 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0203 (2013.01); H05K 1/0306 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49146 (2015.01);
Abstract

In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.

Find Patent Forward Citations

Hable, Wolfram. (2017). Substrate, chip arrangement, and method for manufacturing the same (U.S. Patent No. 9585241). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9585241

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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