The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Jul. 13, 2017
Infineon Technologies Ag, Neubiberg, DE;
Mark Pavier, Felbrigde, GB;
Wolfram Hable, Neumarkt, DE;
Angela Kessler, Sinzing, DE;
Michael Sielaff, Erwitte, DE;
Anton Pugatschow, Soest, DE;
Charles Rimbert-Riviere, Soest, DE;
Marco Sobkowiak, Warstein, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A package which comprises a chip carrier, at least one electronic chip mounted on the chip carrier, an electrically conductive contact structure electrically coupled with the at least one electronic chip, and a mold-type encapsulant encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip, wherein the chip carrier comprises a thermally conductive and electrically insulating core covered on both opposing main surfaces thereof by a respective brazed electrically conductive layer.