The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2015

Filed:

Jun. 27, 2012
Applicants:

Ralf Otremba, Kaufbeuren, DE;

Josef Hoeglauer, Kirchhein-Heimstetten, DE;

Juergen Schredl, Mering, DE;

Xaver Schloegel, Sachsenkam, DE;

Klaus Schiess, Allensbach, DE;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Josef Hoeglauer, Kirchhein-Heimstetten, DE;

Juergen Schredl, Mering, DE;

Xaver Schloegel, Sachsenkam, DE;

Klaus Schiess, Allensbach, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/60 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49575 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/48 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/45 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04034 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05187 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05618 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05638 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/211 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40105 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45499 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/48476 (2013.01); H01L 2224/48499 (2013.01); H01L 2224/48624 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82104 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85815 (2013.01); H01L 2224/92136 (2013.01); H01L 2224/92137 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/19107 (2013.01);
Abstract

In accordance with an embodiment of the present invention, a semiconductor device includes a leadframe having a plurality of leads and a die paddle and a semiconductor module attached to the die paddle of the leadframe. The semiconductor module includes a first semiconductor chip disposed in a first encapsulant. The semiconductor module has a plurality of contact pads coupled to the first semiconductor chip. The semiconductor device further includes a plurality of interconnects coupling the plurality of contact pads with the plurality of leads, and a second encapsulant disposed at the semiconductor module and the leadframe.


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