The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Apr. 17, 2013
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Ralf Otremba, Kaufbeuren, DE;
Josef Hoeglauer, Heimstetten, DE;
Juergen Schredl, Mering, DE;
Xaver Schloegel, Sachsenkam, DE;
Klaus Schiess, Allensbach, DE;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/34 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 21/50 (2013.01); H01L 23/495 (2013.01); H01L 23/49513 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 24/33 (2013.01); H01L 24/34 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A semiconductor device includes an electrically conducting carrier having a mounting surface. The semiconductor device further includes a metal block having a first surface facing the electrically conducting carrier and a second surface facing away from the electrically conducting carrier. A semiconductor power chip is disposed over the second surface of the metal block.