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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9362240 B1

PDFFull Text
Date of Patent:
Jun. 07, 2016

Filed:

Dec. 06, 2013

Electronic device

Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Khalil Hosseini, Weihmichl, DE;

Joachim Mahler, Regensburg, DE;

Ralf Otremba, Kaufbeuren, DE;

Josef Hoeglauer, Heimstetten, DE;

Juergen Schredl, Mering, DE;

Xaver Schloegel, Sachsenkam, DE;

Klaus Schiess, Allensbach, DE;

Assignee:

Infineon Technologies Austria AG, Villach, AT;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Marc Armand

Assistant Examiner:

Christina Sylivia

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 29/2003 (2013.01); H01L 29/6609 (2013.01); H01L 29/66325 (2013.01); H01L 29/66431 (2013.01); H01L 29/78 (2013.01); H01L 24/48 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37139 (2013.01); H01L 2224/37144 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/37155 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/4103 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48111 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49111 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1032 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01);
Abstract

An electronic device includes multiple semiconductor chips in a single housing. Such semiconductor chips may comprise different semiconductor materials, for example they may comprise GaN. Using bonding clips instead of bonding wires is an efficient way of connecting such semiconductor chips to a substrate.

Find Patent Forward Citations

Hosseini, Khalil. (2016). Electronic device (U.S. Patent No. 9362240). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9362240

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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