The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Dec. 13, 2018
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Thomas Bemmerl, Schwandorf, DE;
Kuok Wai Chan, Melaka, MY;
Christoph Liebl, Munich, DE;
Bun Kian Tay, Melaka, MY;
Wee Boon Tay, Melaka, MY;
Wae Chet Yong, Malacca, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/4828 (2013.01); H01L 21/56 (2013.01); H01L 23/31 (2013.01); H01L 23/3157 (2013.01); H01L 24/49 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract
A leadless package includes an at least partially electrically conductive carrier having a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed.