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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10978378 B1

PDFFull Text
Date of Patent:
Apr. 13, 2021

Filed:

Dec. 13, 2018

Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Thomas Bemmerl, Schwandorf, DE;

Kuok Wai Chan, Melaka, MY;

Christoph Liebl, Munich, DE;

Bun Kian Tay, Melaka, MY;

Wee Boon Tay, Melaka, MY;

Wae Chet Yong, Malacca, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/4828 (2013.01); H01L 21/56 (2013.01); H01L 23/31 (2013.01); H01L 23/3157 (2013.01); H01L 24/49 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract

A leadless package includes an at least partially electrically conductive carrier having a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed.

Find Patent Forward Citations

Bemmerl, Thomas. (2021). Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier (U.S. Patent No. 10978378). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10978378

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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