Thomas Bemmerl

This inventor holds 29 USPTO granted patents and 9 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Osram Opto Semiconductors Gmbh, Infineon Technologies Austria Ag. Active years: 2006-2025.

USPTO Granted Patents = 29 (Patent Applications = 9)

% Patents Active = 69.0

EPO Patents = 4 (Patent Applications = 4)

Average Co-Inventor Count = 3.2

ph-index = 5

Forward Citations = 101(Granted Patents)

Company Filing History:

23 out of 15,023

Infineon Technologies Ag

patents

4 out of 1,832

Osram Opto Semiconductors Gmbh

patents

2 out of 2,196

Infineon Technologies Austria Ag

patents

Years Active: 2006-2025

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Areas of Expertise:

Semiconductor Device

Device Fabrication

Leadframe Design

Multichip Systems

Electronic Arrangement

Optoelectronic Component

Solder Ball Elements

Layer Composite

Cooling Element

Composite Material Clip

Conductors

Power Semiconductor Device

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12394697 - Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw (2025-08-19),

2. 12334405 - Electronic devices including vent openings and associated methods (2025-06-17),

3. 11955415 - Semiconductor device package comprising a pin in the form of a drilling screw (2024-04-09),

4. 11869865 - Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof (2024-01-09),

5. 11869830 - Semiconductor package and clip with a die attach (2024-01-09),

6. 11862582 - Package with elevated lead and structure extending vertically from encapsulant bottom (2024-01-02),

7. 11088105 - Semiconductor device and method for fabricating a semiconductor device (2021-08-10),

8. 11069600 - Semiconductor package with space efficient lead and die pad design (2021-07-20),

9. 10978378 - Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier (2021-04-13),

10. 10971457 - Semiconductor device comprising a composite material clip (2021-04-06),

11. 10950509 - Semiconductor device with integrated shunt resistor (2021-03-16),

12. 10886186 - Semiconductor package system (2021-01-05),

13. 10840172 - Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package (2020-11-17),

14. 10026710 - Electronic arrangement (2018-07-17),

15. 9681566 - Electronic arrangement and method for producing an electronic arrangement (2017-06-13),

Title: The Innovative Journey of Thomas Bemmerl

Introduction:

Thomas Bemmerl, a talented inventor hailing from Schwandorf, Germany, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents:

Thomas Bemmerl's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a sustainable energy solution that aims to reduce carbon emissions.

Career Highlights:

With a career spanning over two decades, Thomas Bemmerl has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions to address them. His work has garnered international recognition and praise for its creativity and practicality.

Collaborations:

Throughout his career, Thomas Bemmerl has collaborated with leading technology companies and research institutions to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion:

In conclusion, Thomas Bemmerl's passion for innovation and his dedication to creating technologies that improve lives have solidified his reputation as a pioneering inventor in the tech industry. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators worldwide.