The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Jun. 20, 2023
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Michael Stadler, Munich, DE;
Thomas Bemmerl, Schwandorf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/16 (2006.01); B23K 1/00 (2006.01); B23K 101/42 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/16 (2013.01); B23K 1/0016 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/315 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 24/81 (2013.01); H05K 3/3431 (2013.01); B23K 2101/42 (2018.08); H01L 2021/60007 (2013.01); H01L 2021/60022 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/3511 (2013.01); H05K 2203/1178 (2013.01);
Abstract
An electronic device and method is disclosed. In one example, the electronic device includes a solderable surface and at least one surface opening arranged in the solderable surface. The electronic device further includes an encapsulation material, encapsulating at least one electronic component of the electronic device, and at least one vent opening arranged in an area of the surface opening and extending through the encapsulation material.