The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Mar. 27, 2019
Infineon Technologies Ag, Neubiberg, DE;
Thorsten Scharf, Regensburg, DE;
Ralf Otremba, Kaufbeuren, DE;
Thomas Bemmerl, Schwandorf, DE;
Irmgard Escher-Poeppel, Duggendorf, DE;
Martin Gruber, Schwandorf, DE;
Michael Juerss, Regensburg, DE;
Thorsten Meyer, Regensburg, DE;
Xaver Schloegel, Sachsenkam, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package system comprises a semiconductor package and a cap. The semiconductor package comprises a die pad, a chip mounted or arranged to a first main face of the die pad and an encapsulation body encapsulating the chip and the die pad. The cap covers at least partly an exposed second main face of the die pad. The cap comprises a cap body of an electrically insulating and thermally conductive material and a fastening system fastening the cap to the semiconductor package. The fastening system extends from the cap body towards the encapsulation body or along a side surface of the semiconductor package.