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Wuppertal, Germany

Irmgard Escher-Poeppel

USPTO Granted Patents = 41 (Patent Applications = 6)

Average Co-Inventor Count = 3.1

ph-index = 7

Forward Citations = 158(Granted Patents)

Location History:

Deggendorf, DE (2016)
Regensburg, DE (2008 - 2021)
Duggendorf, DE (2015 - 2023)

Company Filing History:

32 out of 14,724

Infineon Technologies Ag

Intel Mobile Communications Gmbh

Intel Deutschland Gmbh

4. 1 out of 2,094

Infineon Technologies Austria Ag

5. 1 out of 54,750

Intel Corporation

Years Active: 2008-2025

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Areas of Expertise:

Semiconductor Package

Additive Manufacturing

Chip Maintenance

Flip-Chip Package

Metallic Interconnect

Electronic Device Package

MEMS Device

Graphene Layer

Sensor Device

Power Semiconductor Module

Chip Assemblage

Encapsulation Method

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12261146 - Semiconductor package (2025-03-25),

2. 11715719 - Semiconductor package and method of forming a semiconductor package (2023-08-01),

3. 11688713 - Additive manufacturing of a frontside or backside interconnect of a semiconductor die (2023-06-27),

4. 11531056 - Predictive chip-maintenance (2022-12-20),

5. 11393742 - Method for fabricating a semiconductor flip-chip package (2022-07-19),

6. 10957671 - Method for fabricating a semiconductor and semiconductor package (2021-03-23),

7. 10886186 - Semiconductor package system (2021-01-05),

8. 10734352 - Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement (2020-08-04),

9. 10643971 - Method for fabricating a semiconductor and semiconductor package (2020-05-05),

10. 10573533 - Method of reducing a sheet resistance in an electronic device, and an electronic device (2020-02-25),

11. 10438926 - Method for fabricating a semiconductor and semiconductor package (2019-10-08),

12. 10096584 - Method for producing a power semiconductor module (2018-10-09),

13. 10014275 - Method for producing a chip assemblage (2018-07-03),

14. 9818730 - Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement (2017-11-14),

15. 9768037 - Electronic device package including metal blocks (2017-09-19),

Title: Inventor Irmgard Escher-Poeppel

Introduction: Irmgard Escher-Poeppel is a pioneering inventor based in Wuppertal, Germany, known for her innovative contributions to various fields.

Latest Patents: Escher-Poeppel holds several patents in the areas of sustainable energy solutions and eco-friendly technologies, showcasing her commitment to environmental conservation.

Career Highlights: With a background in engineering and a passion for sustainability, Escher-Poeppel has led groundbreaking projects that have revolutionized the way we approach renewable energy sources.

Collaborations: Throughout her career, Escher-Poeppel has collaborated with leading research institutions and universities to further develop her inventions and bring them to the market successfully.

Conclusion: Irmgard Escher-Poeppel's dedication to creating sustainable solutions and her innovative spirit make her a prominent figure in the world of inventors, inspiring future generations to think creatively for a better tomorrow.

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