The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Aug. 29, 2018
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Edward Fuergut, Dasing, DE;
Irmgard Escher-Poeppel, Duggendorf, DE;
Stephanie Fassl, Villach, AT;
Paul Ganitzer, Finkenstein, AT;
Gerhard Poeppel, Duggendorf, DE;
Werner Schustereder, Villach, AT;
Harald Wiedenhofer, Bad Abbach, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/324 (2006.01); H01L 23/31 (2006.01); H01L 21/268 (2006.01); H01L 21/04 (2006.01); H01L 21/225 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 21/324 (2013.01); H01L 21/0455 (2013.01); H01L 21/0485 (2013.01); H01L 21/2254 (2013.01); H01L 21/2258 (2013.01); H01L 21/268 (2013.01); H01L 21/28512 (2013.01); H01L 21/28575 (2013.01); H01L 23/3157 (2013.01);
Abstract
Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance.