logo

For the Inventor, By the Inventor

Villach, Austria

Paul Ganitzer

This inventor holds 23 USPTO granted patents and 5 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2010-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paul Ganitzer. Retrieved from https://idiyas.com/inventor/paul-ganitzer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 95.7

 

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 27(Granted Patents)


Location History:

  • Finkenstein, AT (2020 - 2023)
  • Villach, AT (2010 - 2024)

Company Filing History:

goldMedal14 out of 15,027 
 
Infineon Technologies Ag
 patents
silverMedal9 out of 2,201 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2010-2024

Loading Chart...
Loading Chart...
Areas of Expertise:
Semiconductor Package
Composite Wafer
Metallization Structure
Electronic Component
Sheet Resistance
Separation Trench
Thick Metal Pads
Soldering Process
Connection Electrode
Semiconductor Device
Manufacturing Method
23 patents (USPTO):Explore Patents
1. 12087717 - Semiconductor package and methods of manufacturing a semiconductor package (2024-09-10),
2. 11848237 - Composite wafer, semiconductor device and electronic component (2023-12-19),
3. 11552016 - Semiconductor device with metallization structure on opposite sides of a semiconductor portion (2023-01-10),
4. 11302579 - Composite wafer, semiconductor device and electronic component (2022-04-12),
5. 11081457 - Semiconductor package and methods of manufacturing a semiconductor package (2021-08-03),
6. 10971449 - Semiconductor device with metallization structure on opposite sides of a semiconductor portion (2021-04-06),
7. 10672664 - Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device (2020-06-02),
8. 10593623 - Semiconductor device with metallization structure on opposite sides of a semiconductor portion (2020-03-17),
9. 10573533 - Method of reducing a sheet resistance in an electronic device, and an electronic device (2020-02-25),
10. 9935055 - Methods of manufacturing a semiconductor device by forming a separation trench (2018-04-03),
11. 9887152 - Method for manufacturing semiconductor devices having a metallisation layer (2018-02-06),
12. 9673157 - Processing of thick metal pads (2017-06-06),
13. 9461004 - Semiconductor workpiece having a semiconductor substrate with at least two chip areas (2016-10-04),
14. 9397055 - Processing of thick metal pads (2016-07-19),
15. 9070741 - Method of manufacturing a semiconductor device and a semiconductor workpiece (2015-06-30),

Title: The Innovative Journey of Paul Ganitzer

Introduction: Paul Ganitzer, a visionary inventor hailing from Villach, Austria, has made significant contributions to the world of technology and innovation.

Latest Patents: Paul Ganitzer's latest patents include groundbreaking inventions in the field of renewable energy storage systems and advanced semiconductor technologies.

Career Highlights: With a career spanning over two decades, Paul Ganitzer has been at the forefront of cutting-edge research and development, leading to the successful commercialization of several pioneering technologies.

Collaborations: Throughout his career, Paul Ganitzer has collaborated with leading research institutions, universities, and tech companies to push the boundaries of innovation and bring revolutionary ideas to life.

Conclusion: Paul Ganitzer's relentless pursuit of innovation and his passion for creating a sustainable future through technology make him a true trailblazer in the world of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…