Paul Ganitzer

This inventor holds 23 USPTO granted patents and 5 published patent applications and 2 EPO patents. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2010-2024.

USPTO Granted Patents = 23 (Patent Applications = 5)

% Patents Active = 95.7

EPO Patents = 2 (Patent Applications = 2)

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 27(Granted Patents)

Location History:

Finkenstein, AT (2020 - 2023)
Villach, AT (2010 - 2024)

Company Filing History:

14 out of 15,013

Infineon Technologies Ag

patents

9 out of 2,194

Infineon Technologies Austria Ag

patents

Years Active: 2010-2024

Loading Chart...

23 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12087717 - Semiconductor package and methods of manufacturing a semiconductor package (2024-09-10),

2. 11848237 - Composite wafer, semiconductor device and electronic component (2023-12-19),

3. 11552016 - Semiconductor device with metallization structure on opposite sides of a semiconductor portion (2023-01-10),

4. 11302579 - Composite wafer, semiconductor device and electronic component (2022-04-12),

5. 11081457 - Semiconductor package and methods of manufacturing a semiconductor package (2021-08-03),

6. 10971449 - Semiconductor device with metallization structure on opposite sides of a semiconductor portion (2021-04-06),

7. 10672664 - Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device (2020-06-02),

8. 10593623 - Semiconductor device with metallization structure on opposite sides of a semiconductor portion (2020-03-17),

9. 10573533 - Method of reducing a sheet resistance in an electronic device, and an electronic device (2020-02-25),

10. 9935055 - Methods of manufacturing a semiconductor device by forming a separation trench (2018-04-03),

11. 9887152 - Method for manufacturing semiconductor devices having a metallisation layer (2018-02-06),

12. 9673157 - Processing of thick metal pads (2017-06-06),

13. 9461004 - Semiconductor workpiece having a semiconductor substrate with at least two chip areas (2016-10-04),

14. 9397055 - Processing of thick metal pads (2016-07-19),

15. 9070741 - Method of manufacturing a semiconductor device and a semiconductor workpiece (2015-06-30),

Title: The Innovative Journey of Paul Ganitzer

Introduction: Paul Ganitzer, a visionary inventor hailing from Villach, Austria, has made significant contributions to the world of technology and innovation.

Latest Patents: Paul Ganitzer's latest patents include groundbreaking inventions in the field of renewable energy storage systems and advanced semiconductor technologies.

Career Highlights: With a career spanning over two decades, Paul Ganitzer has been at the forefront of cutting-edge research and development, leading to the successful commercialization of several pioneering technologies.

Collaborations: Throughout his career, Paul Ganitzer has collaborated with leading research institutions, universities, and tech companies to push the boundaries of innovation and bring revolutionary ideas to life.

Conclusion: Paul Ganitzer's relentless pursuit of innovation and his passion for creating a sustainable future through technology make him a true trailblazer in the world of inventors.