The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2023
Filed:
Feb. 23, 2022
Infineon Technologies Ag, Neubiberg, DE;
Paul Ganitzer, Finkenstein, AT;
Carsten von Koblinski, Villach, AT;
Thomas Feil, Villach, AT;
Gerald Lackner, Arnoldstein, AT;
Jochen Mueller, Regensburg, DE;
Martin Poelzl, Ossiach, AT;
Tobias Polster, Villach, AT;
Infineon Technologies AG, Neubiberg, DE;
Abstract
An electronic component includes a semiconductor device including a semiconductor die including a first surface, the first surface including a first metallization structure and edge regions surrounding the first metallization structure, a second surface opposing the first surface and including a second metallization structure, and side faces extending between the first surface and the second surface, wherein the edge regions of the first surface and portions of the side faces are covered by a first polymer layer, wherein the electronic component further includes a plurality of leads and a plastic housing composition, wherein the first metallization structure is coupled to a first lead and the second metallization structure is coupled to a second lead of the plurality of leads.