Company Filing History:
Years Active: 2012-2025
Title: Gerald Lackner: Innovator in Wafer Processing Technology
Introduction
Gerald Lackner is a renowned inventor based in Arnoldstein, Austria, known for his expertise in the field of semiconductor technologies. With a remarkable portfolio of 19 patents, Lackner has made significant contributions to the innovation of wafer processing equipment.
Latest Patents
Lackner's latest patents include advancements in laser beam wafer dicing equipment. One such innovation is the "Wafer Chuck for a Laser Beam Wafer Dicing Equipment," which features a wafer support plate that holds a wafer on a dicing tape. This support plate includes a topographically structured surface that enhances performance by reducing contact area with the dicing tape, a key improvement in precision and efficiency.
Another significant patent is the "Method and Apparatus for Use in Wafer Processing." This method involves a unique receptacle design that incorporates a light port located beneath the wafer. By emitting light from this port, the system processes the wafer based on light that passes by the edge of the wafer and is captured by a sensitive element, further optimizing wafer processing techniques.
Career Highlights
Lackner has spent a notable part of his career at Infineon Technologies AG and Infineon Technologies Austria AG, contributing to various projects that enhance semiconductor manufacturing processes. His work at these companies has been instrumental in pushing the boundaries of technology in the wafer processing domain.
Collaborations
Throughout his career, Gerald Lackner has collaborated with skilled professionals, including Carsten von Koblinski and Karin Schrettlinger. These collaborations have been crucial in fostering innovation and advancing technology within their field.
Conclusion
Gerald Lackner’s contributions to semiconductor technology and wafer processing equipment highlight his role as a leading inventor in the industry. With a substantial number of patents to his name, his innovations continue to influence and propel advancements in semiconductor manufacturing.
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