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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10985041 B1

PDFFull Text
Date of Patent:
Apr. 20, 2021

Filed:

Dec. 14, 2018

Method and apparatus for use in wafer processing

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Thomas Fischer, Villach, AT;

Gerald Lackner, Arnoldstein, AT;

Walter Horst Leitgeb, Wernberg, AT;

Michael Lecher, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Julia Slutsker

Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01B 11/27 (2006.01); H01L 21/68 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67259 (2013.01); G01B 11/272 (2013.01); H01L 21/681 (2013.01); H01L 21/78 (2013.01); H01L 22/20 (2013.01); H01L 21/67092 (2013.01);
Abstract

A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle comprises a light port, and wherein the light port includes a source of light, shining a light from the source of light at an edge of the wafer thereby passing light by the edge of the wafer and processing the wafer on the receptacle based on the light passing by the edge of the wafer and received by a light sensitive element.

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Quick Actions:

Fischer, Thomas. (2021). Method and apparatus for use in wafer processing (U.S. Patent No. 10985041). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10985041

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