Company Filing History:
Years Active: 2018-2025
Title: Innovations of Walter Leitgeb
Introduction
Walter Leitgeb is a notable inventor based in Wernberg, Austria. He has made significant contributions to the field of wafer processing technology, holding a total of 10 patents. His work primarily focuses on enhancing the efficiency and precision of laser beam wafer dicing equipment.
Latest Patents
One of his latest patents is a "Wafer chuck for a laser beam wafer dicing equipment." This invention features a chuck that includes a wafer support plate with a topographically structured surface region. This design reduces the area of contact between the upper surface and the dicing tape, improving the overall efficiency of the dicing process. Another significant patent is the "Method and apparatus for use in wafer processing." This method involves placing a wafer on a receptacle that includes a chuck base with a light port located underneath the wafer. The light emitted from this port processes the wafer based on the light that passes by its edge, enhancing the precision of wafer processing.
Career Highlights
Walter Leitgeb has built a successful career at Infineon Technologies AG, where he has been instrumental in developing innovative solutions for wafer processing. His expertise in this area has led to advancements that benefit the semiconductor industry.
Collaborations
He has collaborated with notable coworkers such as Gerald Lackner and Michael Lecher, contributing to various projects that push the boundaries of technology in wafer processing.
Conclusion
Walter Leitgeb's contributions to the field of wafer processing through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence advancements in technology, making a significant impact on the industry.
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