The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Sep. 30, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Robert Muhr, Villach, AT;

Matthias Fehr, Dresden, DE;

Walter Leitgeb, Wernberg, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G06T 7/00 (2017.01); H01L 21/683 (2006.01); H04N 5/235 (2006.01); H04N 5/247 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); G06T 7/0004 (2013.01); H01L 21/67282 (2013.01); H01L 21/6836 (2013.01); H04N 5/2354 (2013.01); H04N 5/247 (2013.01); G06T 2207/10048 (2013.01); G06T 2207/10064 (2013.01); G06T 2207/30148 (2013.01); H01L 2221/68386 (2013.01);
Abstract

A method of detecting adhesive residue on a wafer after peeling an adhesive film from the wafer by using a peeling tape is described. According to a first aspect, the method includes illuminating the peeling tape with first UV light after the peeling and acquiring a fluorescence image from the peeling tape. According to a second aspect, the method includes illuminating the wafer with second UV light after the peeling and acquiring a fluorescence image from the wafer.


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