Villach, Austria

Thomas Feil

This inventor holds 23 USPTO granted patents and 4 published patent applications and 9 EPO patents, primarily in Semiconductor Devices. Top assignees: Infineon Technologies Austria Ag, Infineon Technologies Ag. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Thomas Feil. Retrieved from https://idiyas.com/inventor/thomas-feil

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.1

ph-index = 3

Forward Citations = 36(Granted Patents)


Company Filing History:


Years Active: 2019-2025

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Areas of Expertise:
Semiconductor Die
Transistor Device
Vertical Power Devices
Composite Wafer
Electronic Component
Oxygen-Doped Si-Layers
Semiconductor Package
Power Semiconductor Device
Field Electrode
Trench Structures
Manufacturing Methods
Body Contacts
23 patents (USPTO):Explore Patents

Title: The Innovative Journey of Thomas Feil

Introduction: Thomas Feil, a visionary inventor hailing from Villach, Austria, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Thomas Feil's latest patents include cutting-edge solutions in renewable energy technology, smart home systems, and advanced medical devices, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Thomas Feil has established himself as a pioneer in the tech industry, holding multiple patents and receiving recognition for his inventive spirit and problem-solving abilities.

Collaborations: Throughout his career, Thomas Feil has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life, fostering a culture of innovation and excellence in the industry.

Conclusion: Thomas Feil's passion for innovation and his relentless drive to push the boundaries of technology continue to inspire the next generation of inventors and shape the future of the tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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