The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Feb. 22, 2019
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01); H01L 25/07 (2006.01); H01L 23/29 (2006.01); H01L 23/538 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 23/3135 (2013.01); H01L 23/3178 (2013.01); H01L 23/3185 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 24/96 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H01L 27/088 (2013.01); H01L 23/3107 (2013.01); H01L 24/48 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06182 (2013.01); H01L 2224/08137 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73227 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract
In an embodiment, a module includes a first electronic device in a first device region and a second electronic device in a second device region. The first electronic device is operably coupled to the second electronic device to form a circuit. Side faces of the first electronic device and of the second electronic device are embedded in, and in direct contact with, a first epoxy layer.