The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
May. 29, 2015
Infineon Technologies Austria Ag, Villach, AT;
Andreas Meiser, Sauerlach, DE;
Markus Zundel, Egmating, DE;
Martin Poelzl, Ossiach, AT;
Paul Ganitzer, Villach, AT;
Georg Ehrentraut, Villach, AT;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A semiconductor workpiece includes a semiconductor substrate, at least two chip areas, components of semiconductor devices being formed in the semiconductor substrate in the at least two chip areas, and a separation trench disposed between adjacent chip areas. The separation trench is formed in a first main surface of the semiconductor substrate and extends from the first main surface to a second main surface of the semiconductor substrate. The second main surface is disposed opposite to the first main surface. The separation trench is filled with at least one sacrificial material.