The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Oct. 28, 2016
Infineon Technologies Ag, Neubiberg, DE;
Olaf Hohlfeld, Warstein, DE;
Guido Boenig, Warstein, DE;
Irmgard Escher-Poeppel, Duggendorf, DE;
Edward Fuergut, Dasing, DE;
Martin Gruber, Schwandorf, DE;
Thorsten Meyer, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
In order to produce a power semiconductor module, a circuit carrier is populated with a semiconductor chip and with an electrically conductive contact element. After populating, the semiconductor chip and the contact element are embedded into a dielectric embedding compound, and the contact element is exposed. In addition, an electrically conductive base layer is produced which electrically contacts the exposed contact element and which bears on the embedding compound and the exposed contact element. A prefabricated metal film is applied to the base layer by means of an electrically conductive connection layer.