Olaf Hohlfeld

This inventor holds 40 USPTO granted patents and 3 published patent applications and 9 EPO patents, primarily in Power Semiconductor Technology. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag, Other. Active years: 2010-2024.

USPTO Granted Patents = 40 (Patent Applications = 3)

% Patents Active = 77.5

EPO Patents = 9 (Patent Applications = 18)

Average Co-Inventor Count = 2.3

ph-index = 6

Forward Citations = 177(Granted Patents)

Company Filing History:

37 out of 15,005

Infineon Technologies Ag

patents

2 out of 2,194

Infineon Technologies Austria Ag

patents

1 out of 834,307

Other

patents

Years Active: 2010-2024

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Areas of Expertise:

Power Module

Semiconductor Arrangement

Chip Assemblies

Fabrication Method

Direct Copper Bonded Substrate

Electronic Device Package

Thermal Management

Transistor Chip Module

Composite Materials

Resiliently Supported Substrates

Explosion-Protected Module

Circuit Carrier

40 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12002724 - Power module with metal substrate (2024-06-04),

2. 11978700 - Power semiconductor module arrangement (2024-05-07),

3. 11955450 - Method for producing a semiconductor arrangement (2024-04-09),

4. 11715647 - Method for producing a substrate (2023-08-01),

5. 11688712 - Semiconductor arrangement and method for producing the same (2023-06-27),

6. 11610830 - Power semiconductor module and method for fabricating the same (2023-03-21),

7. 11557522 - Method for producing power semiconductor module arrangement (2023-01-17),

8. 11437311 - Semiconductor module and method for producing the same (2022-09-06),

9. 11404336 - Power module with metal substrate (2022-08-02),

10. 11322451 - Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module (2022-05-03),

11. 11081414 - Power semiconductor module arrangement (2021-08-03),

12. 10867902 - Semiconductor module and method for producing the same (2020-12-15),

13. 10242969 - Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same (2019-03-26),

14. 10211158 - Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module (2019-02-19),

15. 10096584 - Method for producing a power semiconductor module (2018-10-09),

Title: The Innovative Mind of Olaf Hohlfeld

Introduction: Olaf Hohlfeld, a distinguished inventor hailing from Warstein, Germany, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Olaf Hohlfeld's recent patents showcase his expertise in developing cutting-edge solutions for various industries, including renewable energy, automotive, and telecommunications.

Career Highlights: With a career spanning over two decades, Olaf Hohlfeld has consistently demonstrated his passion for pushing the boundaries of technological advancement. His innovative spirit has led to the creation of numerous patents that have revolutionized the way we approach complex challenges.

Collaborations: Throughout his career, Olaf Hohlfeld has collaborated with leading research institutions, universities, and multinational corporations to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Olaf Hohlfeld's relentless pursuit of innovation and his unwavering commitment to excellence have solidified his reputation as a visionary inventor. His contributions continue to inspire the next generation of innovators to push the limits of what is possible in the world of technology.