The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2023

Filed:

Apr. 03, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Christian Schweikert, Munich, DE;

Juergen Hoegerl, Regensburg, DE;

Olaf Hohlfeld, Warstein, DE;

Waldemar Jakobi, Soest, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/52 (2006.01); H01L 23/367 (2006.01); G01K 1/14 (2021.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); G01K 1/14 (2013.01); H01L 21/4882 (2013.01);
Abstract

A power semiconductor module includes a power semiconductor chip arranged between a first substrate and a second substrate and electrically coupled to the substrates, and a temperature sensor arranged between the substrates and laterally besides the power semiconductor chip such that a first side of the temperature sensor faces the first substrate and a second side of the temperature sensor faces the second substrate. A first electrical contact of the temperature sensor is arranged on the first side and electrically coupled to the first substrate. A second electrical contact of the temperature sensor is arranged on the second side and electrically coupled to the second substrate.


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