The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Nov. 12, 2013
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Olaf Hohlfeld, Warstein, DE;

Juergen Hoegerl, Regensburg, DE;

Angela Kessler, Sinzing, DE;

Magdalena Hoier, Seubersdorf, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/074 (2013.01); H01L 21/565 (2013.01); H01L 23/3135 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/50 (2013.01); H01L 21/566 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor package includes a first semiconductor module including a plurality of semiconductor transistor chips and a first encapsulation layer disposed above the semiconductor transistor chips, and a second semiconductor module disposed above the first semiconductor module. The second semiconductor module includes a plurality of semiconductor driver channels and a second encapsulation layer disposed above the semiconductor driver channels. The semiconductor driver channels are configured to drive the semiconductor transistor chips.


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