logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10867902 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Dec. 14, 2018

Semiconductor module and method for producing the same

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Olaf Hohlfeld, Warstein, DE;

Peter Kanschat, Soest, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Laura M Menz

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 23/31 (2006.01); H01L 23/24 (2006.01); H01L 21/56 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49861 (2013.01); H01L 21/568 (2013.01); H01L 23/24 (2013.01); H01L 23/3107 (2013.01); H01L 23/3135 (2013.01); H01L 23/3672 (2013.01); H01L 23/4006 (2013.01); H01L 23/49844 (2013.01); H01L 25/072 (2013.01); H01L 23/564 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A power semiconductor module arrangement including two or more individual semiconductor devices each semiconductor device having a lead frame, a semiconductor body arranged on the lead frame, and a molding material enclosing the semiconductor body and at least part of the lead frame. The power semiconductor module arrangement further includes a frame surrounding the two or more individual semiconductor devices, and a casting compound at least partly filling a capacity within the frame, thereby at least partly enclosing the two or more individual semiconductor devices.

Find Patent Forward Citations

Hohlfeld, Olaf. (2020). Semiconductor module and method for producing the same (U.S. Patent No. 10867902). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10867902

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…