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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12604752 B1

PDFFull Text
Date of Patent:
Apr. 14, 2026

Filed:

Apr. 10, 2023

Semiconductor die package

Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Edward Fürgut, Dasing, DE;

Irmgard Escher-Poeppel, Duggendorf, DE;

Martin Gruber, Schwandorf, DE;

Ivan Nikitin, Regensburg, DE;

Hans-Joachim Schulze, Taufkirchen, DE;

Assignee:

Infineon Technologies Austria AG, Villach, AT;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/485 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/35 (2013.01); H01L 24/37 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/485 (2013.01); H01L 23/495 (2013.01); H01L 24/03 (2013.01); H01L 24/04 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 2224/0312 (2013.01); H01L 2224/03442 (2013.01); H01L 2224/03502 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/05575 (2013.01); H01L 2224/0558 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/35848 (2013.01); H01L 2224/35986 (2013.01); H01L 2224/37005 (2013.01); H01L 2224/37011 (2013.01); H01L 2224/82101 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor die package includes a semiconductor transistor die having a contact pad on an upper main face. The semiconductor die package also includes an electrical conductor disposed on the contact pad and fabricated by laser-assisted structuring of a metallic material, and an encapsulant covering the semiconductor die and at least a portion of the electrical conductor.

Find Patent Forward Citations

Fürgut, Edward. (2026). Semiconductor die package (U.S. Patent No. 12604752). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12604752

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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