The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Oct. 15, 2021
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Thorsten Meyer, Regensburg, DE;

Thomas Bemmerl, Schwandorf, DE;

Martin Gruber, Schwandorf, DE;

Martin Richard Niessner, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/481 (2013.01); H01L 21/4828 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49541 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01);
Abstract

A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, an encapsulant encapsulating at least part of the electronic component and at least part of the carrier and having a bottom side at a first vertical level. At least one lead is electrically coupled with the electronic component and comprising a first lead portion being encapsulated in the encapsulant and a second lead portion extending out of the encapsulant at the bottom side of the encapsulant. A functional structure at the bottom side extends up to a second vertical level different from the first vertical level.


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