logo

For the Inventor, By the Inventor

Malacca, Malaysia

Bun Kian Tay

This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Infineon Technologies Ag. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bun Kian Tay. Retrieved from https://idiyas.com/inventor/bun-kian-tay

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 75.0

Average Co-Inventor Count = 7.1

ph-index = 1


Company Filing History:

goldMedal4 out of 15,027 
 
Infineon Technologies Ag
 patents

Years Active: 2021-2026

Loading Chart...
4 patents (USPTO):Explore Patents
1. 12575429 - Semiconductor package having a lead frame and a clip frame (2026-03-10),
2. 11515244 - Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture (2022-11-29),
3. 10978378 - Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier (2021-04-13),
4. 10964628 - Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture (2021-03-30),

Title: The Innovations of Bun Kian Tay

Introduction

Bun Kian Tay is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative designs and manufacturing methods that enhance the performance and efficiency of semiconductor packages.

Latest Patents

Among his latest patents are several groundbreaking inventions. One of his notable patents is a clip frame assembly that includes a molded semiconductor package. This package features a lead frame with first leads monolithically formed with a die pad, extending outward in a specific direction. A semiconductor die is attached to the die pad, while a metal clip is connected to a power terminal on the opposite side. This design allows for efficient space utilization and improved electrical performance. Another patent involves an encapsulated leadless package that has an at least partially exposed interior sidewall of a chip carrier. This innovative design includes an electronic chip mounted on a conductive carrier, with an encapsulant that partially encapsulates the chip and carrier, exposing part of the interior sidewall.

Career Highlights

Bun Kian Tay is currently employed at Infineon Technologies AG, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced packaging solutions that meet the demands of modern electronics. His expertise in this field has made him a valuable asset to his company.

Collaborations

Throughout his career, Bun Kian Tay has collaborated with esteemed colleagues such as Martin Gruber and Josef Hoeglauer. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Bun Kian Tay's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His innovative designs and methods continue to influence the industry, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…