Infineon Technologies Ag

Bun Kian Tay

Thorsten Meyer

Josef Hoeglauer

Martin Gruber

Thorsten Scharf

Josef Maerz

Michael Juerss

Thomas Bemmerl

Wae Chet Yong

Chee Voon Tan

Wee Boon Tay

Kuok Wai Chan

Christoph Liebl

Mei Yih Goh

A molded semiconductor package includes a lead frame having one or more first leads monolithically formed with a die pad and extending outward from the pad in a first direction. A semiconductor die is attached to the die pad at a first side of the die. A metal clip of a clip frame is attached to a power terminal at a second side of the die. One or more second leads monolithically formed with the metal clip extend outward from the clip in a second direction different than the first direction. A mold compound embeds the die. The first lead(s) and the second lead(s) are exposed at different sides of the mold compound and do not vertically overlap with one another. Within the mold compound, the clip transitions from a first level above the power terminal to a second level in a same plane as the leads.

Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture

A leadless package includes an at least partially electrically conductive carrier having a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed.

Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier

Growing community of inventors

Melaka, Malaysia

Bun Kian Tay