The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Apr. 16, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Gunar Lorenz, Munich, DE;

Bernd Goller, Otterfing, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81B 7/0061 (2013.01); B81B 7/0064 (2013.01); B81C 1/00301 (2013.01); B81C 1/00309 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); B81B 2207/03 (2013.01); B81C 2203/0792 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS assembly includes a package, wherein the package includes a substrate and a cover element, wherein a through opening is provided in the cover element, a MEMS component within the package on the cover element, an integrated circuit arrangement within the package on the substrate, and a support component within the package on the substrate, wherein the support component on the substrate is electrically coupled, by first electrical connection lines, to the MEMS component on the cover element and is electrically coupled, by second electrical connection lines, to the circuit arrangement on the substrate in order to produce an electrical connection between the MEMS component and the integrated circuit arrangement.


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