The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Feb. 07, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Marc Fueldner, Neubiberg, DE;

Niccolo De Milleri, Villach, AT;

Bernd Goller, Otterfing, DE;

Ulrich Krumbein, Rosenheim, DE;

Gerhard Lohninger, Munich, DE;

Giordano Tosolini, Munich, DE;

Andreas Wiesbauer, Poertschach, AT;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H04R 1/02 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0058 (2013.01); B81B 7/0061 (2013.01); B81B 7/0064 (2013.01); B81B 7/0077 (2013.01); H04R 1/021 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS assembly includes a housing having an internal volume V, wherein the housing has a sound opening to the internal volume V, a MEMS component in the housing adjacent to the sound opening, and a layer element arranged at least regionally at a surface region of the housing that faces the internal volume V, wherein the layer element includes a layer material having a lower thermal conductivity and a higher heat capacity than the housing material of the housing that adjoins the layer element.


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