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For the Inventor, By the Inventor

Malacca, Malaysia

Chau Fatt Chiang

This inventor holds 31 USPTO granted patents and 8 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Infineon Technologies Austria Ag. Active years: 2010-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chau Fatt Chiang. Retrieved from https://idiyas.com/inventor/chau-fatt-chiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 83.9

 

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 29(Granted Patents)


Company Filing History:

goldMedal30 out of 15,027 
 
Infineon Technologies Ag
 patents
silverMedal1 out of 2,201 
 
Infineon Technologies Austria Ag
 patents

Years Active: 2010-2026

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Areas of Expertise:
Semiconductor Packages
Leadframe
Molded Structures
Interconnect Technologies
Laser Processing
Pressure Sensors
Micro-Electrical Mechanical Systems
Encapsulant
Cooling Techniques
Sensor Applications
Conductive Pillars
Manufacturing Methods
31 patents (USPTO):Explore Patents
1. 12765417 - Semiconductor package with metal posts from structured leadframe (2026-10-13),
2. 12300559 - Semiconductor packages and methods for manufacturing thereof (2025-05-13),
3. 12218038 - Leadframe, semiconductor package and method (2025-02-04),
4. 12176222 - Semiconductor package with metal posts from structured leadframe (2024-12-24),
5. 12021000 - Semiconductor package and method for fabricating a semiconductor package (2024-06-25),
6. 11791169 - Dual step laser processing of an encapsulant of a semiconductor chip package (2023-10-17),
7. 11587800 - Semiconductor package with lead tip inspection feature (2023-02-21),
8. 11569196 - Chip to chip interconnect in encapsulant of molded semiconductor package (2023-01-31),
9. 11302613 - Double-sided cooled molded semiconductor package (2022-04-12),
10. 11274984 - Pressure sensor having a lidless/laminate structure (2022-03-15),
11. 11174152 - Over-under sensor packaging with sensor spaced apart from control chip (2021-11-16),
12. 11133281 - Chip to chip interconnect in encapsulant of molded semiconductor package (2021-09-28),
13. 11081417 - Manufacturing a package using plateable encapsulant (2021-08-03),
14. 10886199 - Molded semiconductor package with double-sided cooling (2021-01-05),
15. 10796981 - Chip to lead interconnect in encapsulant of molded semiconductor package (2020-10-06),

Title: The Innovative Mind of Chau Fatt Chiang: A Patent Portfolio on Semiconductors

Introduction: Chau Fatt Chiang, an accomplished inventor based in Melaka, Malaysia, holds an impressive portfolio of 29 patents. His contributions to the field of semiconductor technology have established him as a prominent figure in innovation.

Latest Patents: Among his recent inventions, two patents stand out. The first is for a leadframe used in semiconductor packages. This invention details a leadframe comprising a first and a second electrically conductive part. Each part is designed with coplanar outer contact areas, ensuring optimal functionality. The second patent focuses on a semiconductor package featuring metal posts derived from a structured leadframe. This method outlines a step-by-step process for creating a semiconductor package that enhances electrical connection efficiency while maintaining structural integrity.

Career Highlights: Chau Fatt Chiang has significantly impacted the semiconductor industry through his work at renowned companies such as Infineon Technologies AG and Infineon Technologies Austria AG. His tenure at these organizations underscores his expertise and commitment to advancing semiconductor technology.

Collaborations: Chau has collaborated with talented colleagues, including Swee Kah Lee and Kok Yau Chua. These partnerships highlight the collaborative spirit that drives innovation in the tech community.

Conclusion: Chau Fatt Chiang’s contributions to the semiconductor field exemplify the power of innovation and collaboration. His 29 patents not only reflect his expertise as an inventor but also serve as a testament to the evolving landscape of technology, providing insights and advancements that benefit the entire industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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