The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Dec. 16, 2021
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Si Hao Vincent Yeo, Melaka, MY;

Chan Lam Cha, Melaka, MY;

Ying Dieh Cheong, Melaka, MY;

Chau Fatt Chiang, Melaka, MY;

Cher Hau Danny Koh, Malacca, MY;

Wern Ken Daryl Wee, Melaka, MY;

Swee Kat Lee, Melaka, MY;

Desmond Jenn Yong Loo, Melaka, MY;

Fortunato Lopez, Unterhaching, DE;

Norliza Morban, Melaka, MY;

Khay Chwan Andrew Saw, Melaka, MY;

Sock Chien Tey, Melaka, MY;

Mei Yong Wang, Melaka, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/56 (2013.01); H01L 23/49503 (2013.01);
Abstract

A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.


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