Mei Yong Wang

Title: Innovations of Mei Yong Wang

Introduction

Mei Yong Wang is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents, his work focuses on innovative packaging solutions for electronic components.

Latest Patents

Wang's latest patents include advancements in semiconductor packages and methods for manufacturing them. One patent describes a package that consists of a dielectric carrier, an electronic component mounted on the carrier, and an encapsulant that encapsulates both the dielectric carrier and the electronic component. The corresponding methods for manufacturing this package are also detailed. Another patent features a quad package with conductive clips connected to terminals on the upper surface of a semiconductor die. This packaged semiconductor device includes a carrier with a die attach surface, a semiconductor die mounted on it, and clips that provide external electrical contact for the conductive terminals.

Career Highlights

Mei Yong Wang is currently employed at Infineon Technologies AG, where he continues to innovate in the semiconductor industry. His work has been instrumental in developing new technologies that enhance the performance and reliability of electronic devices.

Collaborations

Wang collaborates with talented coworkers, including Sock Chien Tey and Chan Lam Cha, who contribute to his projects and research efforts.

Conclusion

Mei Yong Wang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of electronic component packaging.