Chan Lam Cha

Title: Innovations by Chan Lam Cha

Introduction

Chan Lam Cha is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of eight patents. His work focuses on innovative packaging solutions for electronic components, which are crucial for the advancement of modern electronics.

Latest Patents

Among his latest patents is a design for semiconductor packages and methods for manufacturing them. This package features a dielectric carrier, an electronic component mounted on the carrier, and an encapsulant that encapsulates both the dielectric carrier and the electronic component. Additionally, he has developed a chip package that includes a chip with at least one contact pad. This package utilizes a contact structure formed from a continuous electrically conductive element, which is attached to the contact pad in multiple positions, allowing for enhanced connectivity and performance.

Career Highlights

Chan has worked with prominent companies in the semiconductor industry, including Infineon Technologies AG and Infineon Technologies Austria AG. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor packaging.

Collaborations

Some of his notable coworkers include Chau Fatt Chiang and Swee Kah Lee, who have collaborated with him on various projects in the semiconductor field.

Conclusion

Chan Lam Cha's innovative work in semiconductor packaging has positioned him as a key figure in the industry. His patents reflect a commitment to advancing technology and improving electronic component design.